Qualcomm to Pay Broadcom US$891 Million in Patent Settlement
Qualcomm, the world's largest maker of mobile phone chips, agreed to pay chip designer Broadcom US$891 million to settle a long running patent dispute to end all courtroom proceedings globally.
The agreement ends litigation in the U.S., the E.U. and Korea and gives each company the right to use the other's patent portfolio for four years, they said in a statement.
Qualcomm will make its first payment of $200 million by the end of June.
The settlement ends a dispute in which Qualcomm had lost at least one court case and saw its market threatened by a U.S. International Trade Commission ban on the import of new mobile phones and PDAs in mid-2007 that contained disputed Qualcomm chips.
The companies said some of the terms of the settlement were not disclosed.