Don't-Miss Component Stories
Intel is looking to partners to help make its mark in smartphones. IDG News Service sits down with Intel's chief executive, Brian Krzanich.
At Mobile World Congress, Intel unwraps details on its Atom chips—the X3, X5, and X7—which will appear in mobile devices later this year.
Intel CEO Brian Krzanich discussed chip updates and mobile security at Mobile World Congress 2015 in Barcelona.
USB 3.1 may be too expensive to start with for flash drives, the USB Implementors Forum CTO says.
MediaTek Ventures will invest in hardware, chips, services and IoT startups
Mark Papermaster says AMD chips' graphics power isn't needed yet, but he also indicates a reluctance to win designs via deep discounting, as rival Intel can afford to do.
JEDEC's eMMC 5.1 standard will also secure storage on mobile devices.
IOT devices can be built in a matter of minutes with ARM and IBM's mbed starter kit
At the ISSCC conference in San Francisco, AMD announces more details surrounding its Carrizo microprocessor, including exactly how it improves battery life over the prior generation, Kaveri.
Nvidia was hit with a class action lawsuit Thursday that claims it misled customers about the capabilities of the GTX 970, which was released in September.
The first premier mobile chips based on Qualcomm's internal architecture will ship for testing by the end of the year.
Talk all you want about the self-driving car, Nvidia CEO Jen-Hsun Huang. Nvidia's fourth-quarter numbers show that the company will be built on PC gaming for many years to come.
In-car wireless adds up to hacking, privacy problems ... ARM buys IoT security firm ... Alibaba funds phone maker ... and more news
ARM debuts its fastest mobile chip ... SAP puts entire enterprise suite on Hana ... Hack cost Sony $15 million ... and more news