Don't-Miss Component Stories
While it won't eliminate heat, this heat pipe could spread it out better and reduce extremes of temperature on the surface of smartphones
The 'Rowhammering' attack exploits electrical interference to change binary values in memory
If you're the kind of person that's been held back by the pathetic 16GB of RAM in your laptop, I'M Intelligent Memory says its new chips can take you to 32GB even if Intel doesn't approve of it.
The new USB 3.1 port in the 12-inch MacBook is backward compatible with USB 3.0 and USB 2.0.
Apple's quest for ultra-thin simplicity in the new 12-inch MacBook has left a lot of technology in a shallow grave, replaced by a single Type-C port.
Intel announces its Iris Pro integrated graphics for desktop PCs and a new NUC that will be powered by the lower-performance version of the new chip.
Intel has done well with PCs and tablets and now CEO Brian Krzanich is chasing an aggressive strategy to get its mobile processors into more handsets.
Intel is looking to partners to help make its mark in smartphones. IDG News Service sits down with Intel's chief executive, Brian Krzanich.
At Mobile World Congress, Intel unwraps details on its Atom chips—the X3, X5, and X7—which will appear in mobile devices later this year.
Intel CEO Brian Krzanich discussed chip updates and mobile security at Mobile World Congress 2015 in Barcelona.
USB 3.1 may be too expensive to start with for flash drives, the USB Implementors Forum CTO says.
MediaTek Ventures will invest in hardware, chips, services and IoT startups
Mark Papermaster says AMD chips' graphics power isn't needed yet, but he also indicates a reluctance to win designs via deep discounting, as rival Intel can afford to do.
JEDEC's eMMC 5.1 standard will also secure storage on mobile devices.
IOT devices can be built in a matter of minutes with ARM and IBM's mbed starter kit