Don't-Miss Storage Stories
Dell’s massive acquisition of EMC reportedly has passed legal muster in China, clearing what is expected to be its last hurdle.
Intel isn't yet shipping its Optane SSDs, but they soon will be available for testing over the cloud.
On Monday, Hewlett-Packard Enterprise extended two of its storage product lines into more affordable territory, in one case adopting an ARM processor to help cut the cost of a system.
The annual Flash Media Summit gives PC enthusiasts a glimpse into the future of storage.
SSDs are being sized up at a dizzying pace, and Samsung is intensifying the race with its highest-capacity 32TB SSD.
Lenovo is developing an SSD storage board with a monstrous 48TB capacity, and the company plans to release it by the middle of next year.
Nobody expected this: Seagate has announced a monster 60TB solid-state drive -- the highest capacity SSD to date -- that could ship next year.
Intel's lightning-fast Optane SSDs and memory won't be limited to PCs featuring the company's own chips, but could work with PCs based on AMD processors as well.
Micron announced its first 3D NAND chip for mobile devices with the goal of cramming more storage into handsets, and maybe reducing reliance on SD card slots.
Intel won't be the only company selling super fast SSDs based on the new 3D Xpoint storage and memory technology; other storage companies will also offer them with technology provided by Micron.
Toshiba's been lagging in the race to raise storage capacity in solid-state drives, but has taken a step forward with its new 7.68TB ZD6000 SSD.
The head of Hewlett-Packard Enterprise’s cloud team is leaving the company in a reorg that will also see the creation of a new cloud division.
July's new PC hardware is more quality than quantity, with graphics cards, storage drives, and laptops cranking things to 11.
Samsung began shipping its 15TB SSD in March to equipment makers, but the drive recently began showing up on retail sites with a price tag of about $10,000.
Western Digital is now manufacturing 3D-stacked NAND flash chips that have 64 layers, 16 stories higher than its previous 48-layer technology -- meaning its 33% more dense.