Manufacturer’s Description

The first ever CPU heatsink to utilize vertical vapor chamber cooling and combine it with heat pipe technology, TPC 812 is prepared to handle the massive heat generated by overclocking and benchmarking. Vertical vapor chamber working in tandem with heat pipes and a specialized heatsink and fin design allow the TPC 812 to outperform the competition.

The Specs

Additional Specifications
Parent Retsku B00CVPRGG8
Quick Glance

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