Manufacturer’s Description

A Giant Leap for IT and Business CapabilitiesIn many organizations, IT infrastructure has begun to constrain business efficiency and growth. For the past decade, IT has rapidly added low-cost hardware to accom- modate business growth. But with data centers now stretched to capacity in terms of power, cooling, and floor space, IT infrastructure is actually limiting IT from investing in innovation. IDC estimates that for every dollar IT spends on hardware to support new users and applications, they spend another 50 cents on power and cooling for existing hardware.

The Specs

Additional Specifications
Green Compliance Yes
Frequency Band Execute Disable Bit Enhanced Halt State (C1E)
Product Line Xeon DP
Thermal Specification 168.8F (76C)
64-bit Processing Yes
Product Model E5540
Process Technology 45 nm
Front Camera HP
Brand Name HP
Thermal Design Power 80 W
QuickPath Interconnect 5.86 GT/s
Processor Technology Enhanced SpeedStep Technology
Quick Glance
More Info
URL http://www.hp.com

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