Manufacturer’s Description

A Giant Leap for IT and Business Capabilities In many organizations, IT infrastructure has begun to constrain business efficiency and growth. For the past decade, IT has rapidly added low-cost hardware to accommodate business growth. But with data centers now stretched to capacity in terms of power, cooling, and floor space, IT infrastructure is actually limiting IT from investing in innovation. IDC estimates that for every dollar IT spends on hardware to support new users and applications, they spend another 50 cents on power and cooling for existing hardware.

The Specs

Additional Specifications
Green Compliance Yes
Frequency Band Execute Disable Bit Enhanced Halt State (C1E)
Product Line Xeon DP
Thermal Specification 168.8F (76C)
64-bit Processing Yes
Product Model E5502
Process Technology 45 nm
Front Camera HP
Brand Name HP
Thermal Design Power 80 W
QuickPath Interconnect 4.80 GT/s
Processor Technology Enhanced SpeedStep Technology
Physical + Memory Specifications
Processor Socket Intel Socket FCLGA1366
L2 Cache Size 512 MB
L3 Cache Size 4 MB
L1 Cache Size 128 KB
Number of Processor Cores Dual-core (2 Core)
Quick Glance
Processor Speed 1860
Processor Socket Intel Socket FCLGA1366
Processor Type Dual-core (2 Core)
Processor Class Intel Xeon
More Info
URL http://www.hp.com
Processor Speed + Class
Processor Speed 1.86 GHz
Processor Class Intel Xeon

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