Intel takes the chiplet concept to the next level with co-EMIB, ODI connections

We're running out of room on a single chip die. Intel's thinking ahead about how to combine many within a single package.
Intel Lakefield

Note: When you purchase something after clicking links in our articles, we may earn a small commission. Read our affiliate link policy for more details.

  • Computers
  • CPUs and Processors
  • Intel
  • Business
As PCWorld's senior editor, Mark focuses on Microsoft news and chip technology, among other beats. He has formerly written for PCMag, BYTE, Slashdot, eWEEK, and ReadWrite.

Coupon Codes