Updated

Intel takes the chiplet concept to the next level with co-EMIB, ODI connections

We're running out of room on a single chip die. Intel's thinking ahead about how to combine many within a single package.
Intel Lakefield
Intel

Note: When you purchase something after clicking links in our articles, we may earn a small commission. Read our affiliate link policy for more details.

As PCWorld's senior editor, Mark focuses on Microsoft news and chip technology, among other beats. He has formerly written for PCMag, BYTE, Slashdot, eWEEK, and ReadWrite.

Coupon Codes