Intel takes the chiplet concept to the next level with co-EMIB, ODI connections

We're running out of room on a single chip die. Intel's thinking ahead about how to combine many within a single package.
Intel Lakefield

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As PCWorld's senior editor, Mark focuses on Microsoft news and chip technology, among other beats. He has formerly written for PCMag, BYTE, Slashdot, eWEEK, and ReadWrite.

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