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Xerox PARC’s new chip will self destruct in 10 seconds

The chip breaks apart on command and was developed under DARPA
martyn_williams@idg.comA new chip developed by Xerox PARC under a DARPA program can self-destruct on command

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Martyn Williams produces technology news and product reviews in text and video for PC World, Macworld, and TechHive from his home outside Washington D.C.. He previously worked for IDG News Service as a correspondent in San Francisco and Tokyo and has reported on technology news from across Asia and Europe.

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